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Radxa
Radxa CM-Q64
SoCQualcomm QCS6490 · 8C
RAM16 GB LPDDR5
Ethernet2.5 GbE
Ports1×USB-C · HDMI 2.0 · RJ45
Specifications 14
Audio
- Audio
- Qualcomm Hexagon DSP (1980 MPPS) + WCD9385 audio codec, Supports headphone output and microphone input
- Codec
- Qualcomm Adreno 633 VPU, Decoding: 1×4K60 / 2×4K30 / 4×1080p60 (H.264 / H.265 / VP9), Encoding: 1×4K30 / 4×1080p30 (H.264 / H.265), Concurrent: 1080p60 decode + 1080p60 encode / 4K30 decode + 1080p30 encode, HDR: HDR10 / HDR10+
Processor & AI
- Processor
- Qualcomm Dragonwing QCS6490 (8-core Kryo 670 CPU, 1x Kryo Gold Prime @ 2.7 GHz, 3x Kryo Gold @ 2.4 GHz, 4x Kryo Silver @ 1.9 GHz, 6nm process)
- Graphics
- Qualcomm Adreno 643 GPU @ 812 MHz, OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.x, DirectX 12
Memory & storage
- Memory
- LPDDR5, Capacity: Up to 16 GB, Bus width: 32-bit (2 channels × 16-bit)
- Storage
- microSD expansion (SDIO 3.0), Onboard eMMC 5.1 or UFS 3.1 (Optional), NVMe expansion (PCIe Gen3 ×2)
Networking
- Networking
- Onboard Ethernet controller (1GbE or 2.5GbE optional), Onboard FCU760K wireless module (Wi-Fi 6 + BT 5.4, optional)
I/O & expansion
- Camera
- Qualcomm Spectra 570L ISP (Triple ISP), 2× MIPI CSI (2-lane), 1× MIPI CSI (4-lane), Up to 4 camera inputs depending on lane allocation and software support
- USB
- USB 3.2 Gen 1, USB 2.0
Physical
- Dimensions
- 55 mm × 40 mm
Software & security
- Operating System
- Qualcomm Linux, Windows, Ubuntu
More details
- AI Performance
- Qualcomm Hexagon 770, 12 TOPS dense compute, Dual HVX + Hexagon CP 2.0 + Hexagon Tensor Accelerator
- Video Output
- Qualcomm Adreno 1075 DPU, 1× USB-C with DP 1.4 Alt Mode (up to 4K60), 1× HDMI 2.0 (up to 4K60), 1× MIPI DSI (4-lane), Up to dual independent displays
- Connectivity
- Supports UART, I2C, SPI, PWM, GPIO
I/O Ports 6
- USB 3.2 Gen 1
- USB 2.0
- 1x USB-C
- DP 1.4
- 1x HDMI 2.0
- Ethernet
Price history
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